EP2323178
Light-emitting device, method for manufacturing same, molded body and sealing member
- Nichia Corporationsince Apr 15, 2011
Disclosed is a light-emitting device comprising a light-emitting element (10) composed of a gallium nitride compound semiconductor having an emission peak wavelength of not less than 430 nm; a molded body (40) provided with a recessed portion having a bottom surface on which the light-emitting element (10) is mounted and a lateral surface; and a sealing member (50) containing an epoxy resin including a triazine derivative epoxy resin, or a silicon-containing resin. The molded body (40) is obtained by using a cured product of a thermosetting epoxy resin composition essentially containing an epoxy resin including a triazine derivative epoxy resin, and has a reflectance of not less than 70% at the wavelengths of not less than 430 nm.
| Date | Case | Division | Type | Outcome | Parties |
|---|---|---|---|---|---|
| Mar 25, 2025 | UPC APP 14382/2025 | Dusseldorf LD | Procedural application | Locked | Nichia Corporation +1 |
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